| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electrode structure of a semiconductor module for sufficiently securing heat radiation by using an electrode connected to a semiconductor element. <P>SOLUTION: In the mold type semiconductor module 1 for mounting the semiconductor element 3 on a lead frame 2 and connecting the electrode 5 on the semiconductor element 3, the electrode 5 is connected to the semiconductor element 3 in the state in which the one end 51 is folded to be overlapped on a plurality of layers. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
