发明名称 SURFACE TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide a surface treatment method capable of forming a film which has excellent surface roughness and leaves no high residual stress in a base material while maintaining high adhesive force to the base material subjected to discharge surface treatment. SOLUTION: The surface treatment method comprises a discharge surface treatment step of forming a first film of a desired composition on a surface of a work 102 by the discharge surface treatment method, a flattening step of grinding or polishing the surface of the first film 105, and a film forming step of forming a second film 107 by a vapor phase epitaxial method or a plating method on the ground or polished first film 105. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005008942(A) 申请公布日期 2005.01.13
申请号 JP20030173724 申请日期 2003.06.18
申请人 MITSUBISHI ELECTRIC CORP;HOKUNETSU:KK 发明人 GOTO AKIHIRO;YAGO TOSHIRO
分类号 B22F5/00;C23C26/00;C23C28/04;(IPC1-7):C23C28/04 主分类号 B22F5/00
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