ADHESIVE FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND DISPLAY USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide an adhesive suitable for forming by transferring and bonding a thin-film semiconductor device and to provide a thin type semiconductor device produced by using the adhesive. SOLUTION: The adhesive for the semiconductor device has≥50 gf/cm adhesive strength to silicon and/or an inorganic silicon compound layer and≤50 ppm/°C coefficient of linear expansion after curing. A cross-linkable resin such as an acrylic resin or an epoxy resin is preferably contained in the adhesive and even an inorganic filler is preferably contained therein. A semiconductor device in which a semiconductor element is bonded onto a plastic film with the adhesive for the semiconductor device and the thickness of the semiconductor element to be bonded is≤50μm is also included. COPYRIGHT: (C)2005,JPO&NCIPI