| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a mounting structure of a multilayer ceramic electronic component having a voltage resistance, a mounting method for the electronic component, by which such a mounting structure can be acquired, and the electronic component capable of adopting such a mounting method and having an excellent soldability. <P>SOLUTION: A multilayer ceramic capacitor 10 in which a thermoplastic resin layer 22 is formed on the whole surface of a capacitor element 12 is mounted on a substrate 30. An external electrode 20 is exposed by melting the resin layer 22 on the electrode 20 by heat when soldering and by moving the resin layer 22 while being flowed, and joined with an electrode 32 by a solder 34. In the obtained mounting structure, the whole surface of the capacitor element 12 excepting a soldering section is coated with the resin layer 22. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
