发明名称 |
METHOD FOR FORMING METALLIC LAYER |
摘要 |
PROBLEM TO BE SOLVED: To form a metallic layer which covers the inside of a defective hole, has a uniform thickness, and has a superior surface quality. SOLUTION: This forming method comprises the step of forming a metallic undercoating 4 on the surface of a plastic film 1 with a dry electroplating method; and the step of forming an electroconductive organic polymer coating selectively inside the defective hole 6 to cover it, by contacting an organic monomer-containing liquid with the metallic undercoating 4: and further comprises forming a plated metallic film 10 on the metallic undercoating 4 with a wet process, by forming the metallic film with an electroplating method. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005008941(A) |
申请公布日期 |
2005.01.13 |
申请号 |
JP20030173705 |
申请日期 |
2003.06.18 |
申请人 |
MITSUBISHI SHINDOH CO LTD;ENTHONE JAPAN LTD |
发明人 |
KANDA YUICHI;ABE TAKASHI;TANAKA ATSUSHI;NISO KEISUKE |
分类号 |
C23C18/16;C23C18/20;C23C28/00;C25D5/34;C25D5/56;C25D7/00;H05K3/00;H05K3/14;H05K3/22;H05K3/38;(IPC1-7):C25D7/00 |
主分类号 |
C23C18/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|