发明名称 METHOD FOR FORMING METALLIC LAYER
摘要 PROBLEM TO BE SOLVED: To form a metallic layer which covers the inside of a defective hole, has a uniform thickness, and has a superior surface quality. SOLUTION: This forming method comprises the step of forming a metallic undercoating 4 on the surface of a plastic film 1 with a dry electroplating method; and the step of forming an electroconductive organic polymer coating selectively inside the defective hole 6 to cover it, by contacting an organic monomer-containing liquid with the metallic undercoating 4: and further comprises forming a plated metallic film 10 on the metallic undercoating 4 with a wet process, by forming the metallic film with an electroplating method. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005008941(A) 申请公布日期 2005.01.13
申请号 JP20030173705 申请日期 2003.06.18
申请人 MITSUBISHI SHINDOH CO LTD;ENTHONE JAPAN LTD 发明人 KANDA YUICHI;ABE TAKASHI;TANAKA ATSUSHI;NISO KEISUKE
分类号 C23C18/16;C23C18/20;C23C28/00;C25D5/34;C25D5/56;C25D7/00;H05K3/00;H05K3/14;H05K3/22;H05K3/38;(IPC1-7):C25D7/00 主分类号 C23C18/16
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