发明名称 |
WAFER REVIEW APPARATUS FOR REVIEWING DEFECTS OF WAFER BY USING OPTICAL MICROSCOPE AND ATOMIC FORCE MICROSCOPE |
摘要 |
PURPOSE: A wafer review apparatus is provided to perform rapidly a process for reviewing defects of a wafer by using an optical microscope and an atomic force microscope. CONSTITUTION: A storage unit(200) stores a defect map received from a wafer inspection system. An optical microscope(300) is used for reviewing defects on the defect map by using an object lens and an eyepiece. An atomic force microscope(400) reviewing defects on the defect map in atom units by using a cantilever. An input unit(500) selects one of the optical microscope and the atomic force microscope. A display unit(600) forms the defects as images. A stage(700) is used for supporting the wafer having the defects. A control unit(800) controls the storage unit, the optical microscope, the atomic force microscope, the input unit, the display unit, and the stage.
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申请公布号 |
KR20050004551(A) |
申请公布日期 |
2005.01.12 |
申请号 |
KR20030044779 |
申请日期 |
2003.07.03 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, KWANG SIK;KIM, KYUNG HO |
分类号 |
H01L21/66;(IPC1-7):H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
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主权项 |
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地址 |
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