EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICES COMPRISING ZINC BORATE COMBINED WITH POLYHEDRAL OLIGOMERIC SILSESQUIOXANE AS FLAME RETARDANT

摘要

PURPOSE: Provided is an epoxy resin composition for sealing semiconductor devices, which uses halogen-free flame retardants and thus is environmental-friendly, and has excellent reliability and moldability. CONSTITUTION: The epoxy resin composition for sealing semiconductor devices comprise: (1) an epoxy resin; (2) a curing agent; (3) a curing accelerator; (4) a flame retardant; (5) modified silicone oil; and (6) inorganic fillers, wherein the flame retardant is zinc borate represented by the formula 1 of 2ZnO·3B2O3·3.5H2O combined with POSS(polyhedral oligomeric silsesquioxane) represented by the following formula 2. In formula 2, R represents a phenyl group.