| 发明名称 |
PROCESS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD ASSEMBLY |
| 摘要 |
Package body 100a which is formed by performing the steps of circuit substrates, the step of mounting IC chips, the step of encapsulating with resin and the step of forming electrodes is attached to standard member 8. After this attaching step, semiconductor packages are formed by performing the cutting step where the package body is diced into a plurality of circuit substrates 1. |
| 申请公布号 |
EP0932198(A4) |
申请公布日期 |
2005.01.12 |
| 申请号 |
EP19980917679 |
申请日期 |
1998.04.24 |
| 申请人 |
CITIZEN WATCH CO. LTD. |
发明人 |
ISHIDA, YOSHIHIRO;SHIMIZU, KIYOSHI;SATO, TETSUO;NISHIKATA, SHINICHI;ISHIWATA, SHUICHI;OMURA, ATSUSHI;OHARA, TSUTOMU |
| 分类号 |
H01L23/32;H01L21/56;H01L21/60;H01L23/31 |
主分类号 |
H01L23/32 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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