HOT MELT ADHESIVE WITH LOW APPLICATION TEMPERATURE AND HIGH HEAT STRESS VALUE

摘要

PURPOSE: Provided is a hot melt adhesive which is applied at even lower temperatures, and has effect of saving cost and convenience, both in the manufacture and use thereof, as well as performance improvement. CONSTITUTION: The low application temperature hot melt adhesive is applied at a temperature of 300 deg.F or below and the heat stress value of the attached adhesive and the adhesive application temperature are separated by 110 deg.F or less. The hot melt adhesive comprises a semi-crystalline polymer, a wax and a tackifying resin. The hot melt adhesive is employed to seal and/or form carton, case, tray, bag or book, or to attach a substrate to a similar or dissimilar substrate via application process.