| 摘要 |
<p>An IC socket including an insulative housing (2) having an IC package receiving recess (14), in which an IC package (76) is received. Contacts (8) are implanted within cavities (30), which are provided in the IC package receiving recess (14) in a matrix arrangement. Each contact (8) includes: a base portion, which is press fitted into a cavity (30); an upwardly extending contact arm (44), which is offset above a cavity (30) which is adjacent, in a first direction, to the cavity in which the base portion is press fitted; and a downwardly extending connecting portion, for electrically connecting with a circuit board. The insulative housing (2) includes: first housing walls (72), which are provided between rows of cavities (30) adjacent to each other in the first direction; and a second housing walls (70), which are provided between rows of cavities adjacent to each other in a second direction perpendicular to the first direction. The second housing walls (70) have greater heights than those of the first housing walls (72).</p> |
