发明名称 |
Method and apparatus for removing heat from a component |
摘要 |
<p>An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first portion (115) coupled to component (102) and a second portion (117) coupled to heat removal device (108). A method for removing heat (118) from a component (102) on a surface (104) of an electronics module (100) includes generating heat (118), conveying the heat from the component (102) by way of a heat conductor (112) and depositing the heat (118) to a heat removal device mounted to the electronics module (100) <IMAGE></p> |
申请公布号 |
EP1303174(A3) |
申请公布日期 |
2005.01.12 |
申请号 |
EP20020019564 |
申请日期 |
2002.09.02 |
申请人 |
MOTOROLA, INC. |
发明人 |
BERTRAM, THOMAS J.;WONG, HENRY |
分类号 |
H01L23/36;H01L23/367;H01L23/427;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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