发明名称 |
Processing a memory link with a set of at least two laser pulses |
摘要 |
<p>A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 500 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single "pulse" by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.</p> |
申请公布号 |
GB2390834(B) |
申请公布日期 |
2005.01.12 |
申请号 |
GB20030017976 |
申请日期 |
2002.12.17 |
申请人 |
* ELECTRO SCIENTIFIC INDUSTRIES INC |
发明人 |
YUNLONG * SUN;EDWARD J * SWENSON;RICHARD S * HARRIS |
分类号 |
B23K26/00;B23K26/06;B23K26/067;B23K101/38;G11C17/14;H01L21/82;H01L21/8242;H01L23/525;H01L27/10;H01L27/108;H01S3/00;(IPC1-7):H01S3/10;H01S3/082 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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