SEMICONDUCTOR PACKAGE HAVING MULTI-CHIPS FOR REDUCING SUM OF CURRENT BY PARTIALLY OPERATING POWER GENERATION CIRCUITS

摘要

PURPOSE: A semiconductor package having multi-chips is provided to reduce sum of current in the semiconductor package by partially operating power generation circuits within chips. CONSTITUTION: A semiconductor package is formed with a plurality of chips. Each of the chips has a common circuit for performing the same function. A part of the common circuits of the chips is in an enabling state while the other part of the common circuits of the chips is in a disabling state. The common circuits in the enabling state provide common circuit functions to the chips including the common circuits in the disabling state. The chips are formed with semiconductor memory chips.