| 摘要 |
PURPOSE: A semiconductor device and a lead frame are provided to prevent reliably short-circuit between lead terminals and to perform smoothly a cutting process by improving a structure of the lead frame. CONSTITUTION: A die pad(3) includes a main surface on which a semiconductor chip(2) is loaded. A plurality of lead terminals are arranged along a periphery of the die pad, spaced from each other, and electrically connected to the semiconductor chip. A resin member(8) is used for covering the semiconductor chip, the die pad, and a part of the lead terminals, and includes a lateral surface. Each of the lead terminals has one end opposed to the semiconductor chip and the other end uncovered with the resin member and extending on the same plane as the lateral surface. The other end is smaller in size in a direction of alignment of lead terminals than the one end. |
