| 摘要 |
PURPOSE: Provided is a polyimide resin, which has all of low relative dielectric constant, low dielectric dissipation factor and high heat resistance, and thus is suitable for use as electrical insulating materials in wiring circuit boards for electronic appliances operated at high frequencies. CONSTITUTION: The polyimide resin for electrical insulating materials comprises a polyimide resin having a repeating unit represented by the formula 1, wherein R1 represents a bivalent organic group. Preferably, the bivalent group R1 in the polyimide resin is represented by the formula 2, wherein R2' is each a hydrogen atom, a halogen atom or a hydrocarbon group, and n represents an integer of 1 to 5, the formula 3, or the formula 4. The polyimide resin has a number average molecular weight of from 1,000 to 100,000. |
