发明名称 |
METHOD OF TREATMENT OF POROUS DIELECTRIC FILMS TO REDUCE DAMAGE DURING CLEANING |
摘要 |
A device, method, and system for treating low-k dielectric material films to reduce damage during microelectronic component cleaning processes is disclosed. The current invention cleans porous low-k dielectric material films in a highly selectivity with minimal dielectric material damage by first treating microelectronic components to a passivating process followed by a cleaning solution process. |
申请公布号 |
EP1495366(A1) |
申请公布日期 |
2005.01.12 |
申请号 |
EP20030746699 |
申请日期 |
2003.04.11 |
申请人 |
SUPERCRITICAL SYSTEMS INC. |
发明人 |
SCHILLING, PAUL |
分类号 |
G03F7/40;B08B7/00;C03C15/00;C03C17/30;C03C23/00;G03F7/42;H01L21/027;H01L21/3065;H01L21/311;H01L21/316;H01L23/532;(IPC1-7):G03F7/00;C25F5/00;C25F1/00;C23C14/02;C23C8/00;G03F7/36;G03F7/16 |
主分类号 |
G03F7/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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