发明名称 |
Method and apparatus for detection of defects using thermal stimulation |
摘要 |
A method for inspecting an object and detecting defects is taught (BGA and Flip-Chip solder joints on a PCB particularly). The method comprises injecting a thermal stimulation on the object; capturing a sequence of consecutive infrared images of the object to record heat diffusion resulting from the heat pulse; comparing the heat diffusion on said object to a reference; and determining whether the object comprises any defects. Also described is a system comprising a mounting for mounting the object; a thermal stimulation module for applying a thermal stimulation to the bottom surface of the object; an infrared camera for capturing infrared images of the object on the top surface of the object to record a change in infrared radiation from the top surface resulting from the thermal stimulation; and a computer for comparing the change in infrared radiation within a region on the top surface to a reference and determining whether the object comprises any defects.
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申请公布号 |
US6840667(B2) |
申请公布日期 |
2005.01.11 |
申请号 |
US20030419709 |
申请日期 |
2003.04.18 |
申请人 |
PHOTON DYNAMICS, INC. |
发明人 |
SCHLAGHECK JERRY;PASTOR MARC;LEVESQUE MARC;COURNOYER ALAIN |
分类号 |
G01N25/72;(IPC1-7):G01N25/72 |
主分类号 |
G01N25/72 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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