发明名称 Method of manufacturing SOI element having body contact
摘要 A semiconductor device comprises a semiconductor substrate having a first insulator, and a semiconductor channel region formed on the first insulator, wherein the semiconductor channel region comprising at least two first regions both having the first conductivity type, a second region of the conductivity type opposite to the first conductivity type, the second region being provided between the two first regions, a second insulator formed on the second region, a gate electrode formed on the second insulator, a third region having the same conductivity type as that of the second region, the third region being electrically conductive to the second region, a third insulator formed on the third region, the third insulator having a width narrower than the widths of an isolation region for isolating the semiconductor formation region, and a fourth region of the same conductivity type as that of the third region, the fourth region being electrically conductive to the third region.
申请公布号 US6841828(B2) 申请公布日期 2005.01.11
申请号 US20030439370 申请日期 2003.05.16
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 KAWANAKA SHIGERU;YAMADA TAKASHI
分类号 H01L29/786;H01L21/336;(IPC1-7):H01L27/01;H01L27/12;H01L31/039 主分类号 H01L29/786
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