| 发明名称 |
Chemical mechanical polishing systems and methods for their use |
| 摘要 |
Alpha-amino acid containing chemical mechanical polishing compositions and slurries that are useful for polishing substrates including multiple layers of metals, or metals and dielectrics.
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| 申请公布号 |
US6840971(B2) |
申请公布日期 |
2005.01.11 |
| 申请号 |
US20020324634 |
申请日期 |
2002.12.19 |
| 申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
WANG SHUMIN;KAUFMAN VLASTA BRUSIC |
| 分类号 |
B24B57/02;B24B37/00;C09C1/68;C09G1/02;C09K3/14;C23F3/06;H01L21/304;H01L21/321;(IPC1-7):B24D3/02 |
主分类号 |
B24B57/02 |
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代理人 |
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