发明名称 Fine conductive particles for making anisotropic conductive adhesive composition
摘要 Fine conductive particles are composed of metallic conductive powder, and an insulating organic capping layer on the grains of the powder. The metallic conductive powder have grains with a diameter ranging from 1 to 20 microns, and the capping layer has a thickness of 50-400 nm, which is able to flow by thermo-pressing. The insulating organic capping layer is prepared from a silane having a reactive functionality, a fluorine-containing silane and a compound or a resin having a functionality able to reactive with the reactive functionality.
申请公布号 US6841094(B2) 申请公布日期 2005.01.11
申请号 US20020246460 申请日期 2002.09.19
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 LI HSUN-TIEN;HUANG SHU-CHEN;CHEN KAI-CHI
分类号 H01B1/22;H05K3/32;(IPC1-7):H01B1/22 主分类号 H01B1/22
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