发明名称 |
Fine conductive particles for making anisotropic conductive adhesive composition |
摘要 |
Fine conductive particles are composed of metallic conductive powder, and an insulating organic capping layer on the grains of the powder. The metallic conductive powder have grains with a diameter ranging from 1 to 20 microns, and the capping layer has a thickness of 50-400 nm, which is able to flow by thermo-pressing. The insulating organic capping layer is prepared from a silane having a reactive functionality, a fluorine-containing silane and a compound or a resin having a functionality able to reactive with the reactive functionality.
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申请公布号 |
US6841094(B2) |
申请公布日期 |
2005.01.11 |
申请号 |
US20020246460 |
申请日期 |
2002.09.19 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
LI HSUN-TIEN;HUANG SHU-CHEN;CHEN KAI-CHI |
分类号 |
H01B1/22;H05K3/32;(IPC1-7):H01B1/22 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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