发明名称 Method of manufacturing a semiconductor device and manufacturing system
摘要 Automatic generation of processing conditions will be provided, based on a database and process modeling by a computer equipped in semiconductor device fabrication equipment, by using input of wafer processing history including the thickness and quality. The computer equipped in semiconductor device fabrication equipment obtains the wafer processing and inspection results from a production line management computer in order to assist input of the process history. The computer in the fabrication equipment can be connected to computers in a fabrication equipment manufacturer on a communication network to automatically provide process conditions and maintenance schedule.
申请公布号 US6842658(B2) 申请公布日期 2005.01.11
申请号 US20010791666 申请日期 2001.02.26
申请人 HITACHI, LTD. 发明人 IZAWA MASARU;MORI MASAHITO;NEGISHI NOBUYUKI;TACHI SHINICHI
分类号 H01L21/302;G05B19/418;H01L21/00;H01L21/02;H01L21/3065;(IPC1-7):G06F19/00 主分类号 H01L21/302
代理机构 代理人
主权项
地址