发明名称 |
Method of manufacturing a semiconductor device and manufacturing system |
摘要 |
Automatic generation of processing conditions will be provided, based on a database and process modeling by a computer equipped in semiconductor device fabrication equipment, by using input of wafer processing history including the thickness and quality. The computer equipped in semiconductor device fabrication equipment obtains the wafer processing and inspection results from a production line management computer in order to assist input of the process history. The computer in the fabrication equipment can be connected to computers in a fabrication equipment manufacturer on a communication network to automatically provide process conditions and maintenance schedule.
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申请公布号 |
US6842658(B2) |
申请公布日期 |
2005.01.11 |
申请号 |
US20010791666 |
申请日期 |
2001.02.26 |
申请人 |
HITACHI, LTD. |
发明人 |
IZAWA MASARU;MORI MASAHITO;NEGISHI NOBUYUKI;TACHI SHINICHI |
分类号 |
H01L21/302;G05B19/418;H01L21/00;H01L21/02;H01L21/3065;(IPC1-7):G06F19/00 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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