发明名称 |
Injection molding apparatus and method |
摘要 |
The present invention is directed to an injection molding apparatus and method capable of preventing the occurrence of over-packing. The apparatus includes a pair of dies for forming a plurality of cavities therebetween; die closing devices for closing the pair of dies under a prescribed pressure; an injection device for injecting a molten resin into respective cavities under a prescribed pressure; and, a control device for controlling the die closing devices and the injection device. Further, the apparatus comprises a plurality of pressure sensors for detecting respective pressures in respective cavities and a control device that controls the injection device and/or the die closing devices to reduce the rate of injection of the molten resin and/or the force of closing the dies and, otherwise, stops the injection and/or the die closing operation when the pressure difference between cavities is found to be greater than a prescribed value on the basis of sensed values from the respective pressure sensors.
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申请公布号 |
US6841103(B2) |
申请公布日期 |
2005.01.11 |
申请号 |
US20010778805 |
申请日期 |
2001.02.08 |
申请人 |
SONY DISC TECHNOLOGY INC. |
发明人 |
KISHI SHINSUKE;YOSHIMURA HIDEAKI |
分类号 |
B29C45/64;B29C45/00;B29C45/46;B29C45/76;B29C45/77;(IPC1-7):B29C45/77;B29C45/80 |
主分类号 |
B29C45/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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