发明名称 Solder application technique
摘要 A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.
申请公布号 US6840432(B1) 申请公布日期 2005.01.11
申请号 US20030419071 申请日期 2003.04.21
申请人 MCGRAW-EDISON COMPANY 发明人 RAMARGE MICHAEL M.;BAILEY DAVID P.;HARTMAN THOMAS C.
分类号 B23K1/20;B23K35/00;B23K35/12;H01C7/108;(IPC1-7):B23K1/20;B23K31/02 主分类号 B23K1/20
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