| 摘要 |
A semiconductor device includes a first conductive pattern provided on one surface of the substrate; a second conductive pattern provided on the other surface of the substrate; at least two first semiconductor chips mounted on one surface of the substrate, and connected to the first conductive pattern; a second semiconductor chip mounted so as to stride the first semiconductor chips adjacent to each other; and a first wiring passing between the first semiconductor chips adjacent to each other, and through openings formed in the substrate, an end thereof being connected to the surface of the second semiconductor chip facing the substrate, and the other end being connected to the second conductive pattern.
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