| 摘要 |
FIELD: plating processes and equipment. ^ SUBSTANCE: apparatus includes unit for guiding electrolyte flow onto surface to be plated; device for controlling quantity and (or) rate of ion reduction on selected zones of plated surface; unit for controlling electric current applied to said zones. Unit for controlling electric current includes circuit for measuring electric current passing to selected zones of plated surface and for controlling electric current depending upon measurement results. Apparatus is provided with unit for creating turbulence of electrolyte flow close to said zones in order to provide vortexes at colliding of electrolyte flow with said zones and to increase rate of ion reduction. Computer program product includes computer-read program for guiding electrolyte flow onto plated surface and for controlling quantity and (or) rate of ion reduction in selected zones of plated surface. Software is stored on carrier used in computer. ^ EFFECT: increased speed, enhanced uniformness of plating. ^ 32 cl, 9 dwg |
