HYBRID INTEGRATED CIRCUIT FOR IMPROVING HEAT DISSIPATION CAPABILITY AND ELECTROMAGNETIC FIELD SHIELDING CAPABILITY BY FIXING BOTTOM FACE OF SEMICONDUCTOR CHIP ON GROUND CONDUCTIVE LAYER WITHIN CAVITY TO REDUCE HEAT TRANSFER DISTANCE BETWEEN SEMICONDUCTOR CHIP AND MOTHER BOARD

摘要

PURPOSE: A hybrid integrated circuit is provided to improve heat dissipation capability and electromagnetic field shielding capability by fixing a bottom face of a semiconductor chip on a ground conductive layer within a cavity to reduce a heat transfer distance between the semiconductor chip and a mother board. CONSTITUTION: A first wiring substrate(11) includes a plurality of signal line layers(13) and a plurality of ground conductive layers(14). Each of the signal line layers and one ground conductive layer corresponding to the signal line layers are used for forming a micro-strip line. A cavity(12) is formed in the first wiring substrate to expose one of the ground conductive layers from a bottom of the cavity. A semiconductor chip(15) is installed in the cavity and includes a bottom surface fixed to the one of the ground conductive layers. A mounting component(18) is installed on an upper surface of the first wiring substrate except for an upper part of the cavity.