发明名称 MEMORY MANUFACTURING PROCESS WITH BITLINE ISOLATION
摘要 <p>A method of manufacturing an integrated circuit is provided with a semiconductor substrate having a core region and a periphery region. A charge-trapping dielectric layer is deposited in the core region, and a gate dielectric layer is deposited in the periphery region. Bitlines are formed in the semiconductor substrate in the core region and not in the periphery region. A wordline-gate layer is formed and implanted with dopant in the core region and not in the periphery region. A wordline and gate are formed. Source/drain junctions are implanted with dopant in the semiconductor substrate around the gate, and the gate is implanted with a gate doping implantation in the periphery region and not in the core region.</p>
申请公布号 KR20050003357(A) 申请公布日期 2005.01.10
申请号 KR20047016142 申请日期 2003.02.14
申请人 发明人
分类号 H01L21/8247;H01L27/10;H01L21/265;H01L21/28;H01L21/8246;H01L27/105;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/8247
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