发明名称 |
METHOD OF FORMING FLOATING GATE OF FLASH MEMORY DEVICE USING BUFFER OXIDE LAYER FOR PREVENTING DECREASE OF THICKNESS IN FIRST POLYSILICON LAYER AND RESTRAINING ATTACK AGAINST FIRST POLYSILICON LAYER |
摘要 |
PURPOSE: A method of forming a floating gate of a flash memory device is provided to prevent the decrease of thickness of a first polysilicon layer and to restrain the attack against the first polysilicon layer during a pad nitride layer stripping process by forming a buffer oxide layer with minimum thickness between the first polysilicon layer and a pad nitride layer. CONSTITUTION: A tunnel oxide layer(12), a first polysilicon layer(14), a buffer oxide layer(16) and a pad nitride layer(18) are sequentially formed on a semiconductor substrate(10). A trench is formed in the resultant structure by using etching. A gap-fill oxide is formed thereon and the resultant structure is planarized by using the pad nitride layer as a barrier. A strip process for removing completely the pad nitride layer and partially the buffer oxide layer is performed thereon. The remaining buffer oxide layer is removed by using a cleaning process.
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申请公布号 |
KR20050002250(A) |
申请公布日期 |
2005.01.07 |
申请号 |
KR20030043619 |
申请日期 |
2003.06.30 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
DONG, CHA DEOK;HAN, IL KEOUN |
分类号 |
H01L21/8247;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L27/115 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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