发明名称 HEAT SINK FOR PRINTED CIRCUIT BOARD HAVING AIR CIRCULATION STRUCTURE CAPABLE OF INCREASING AIR CONTACT AREA OF THE HEAT SINK
摘要 PURPOSE: A heat sink is provided to increase the air contact area of the heat sink and achieve improved cooling effects by permitting air to circulate through the heat sink. CONSTITUTION: A heat sink(30) is installed at a PCB so as to absorb and radiate heat generated from elements. The heat sink has an air circulation portion(34) having an opening(32). The heat sink has a plurality of air inlet holes(36) for communicating an intermediate part of the air circulation portion to outside so as to circulate air.
申请公布号 KR20050002187(A) 申请公布日期 2005.01.07
申请号 KR20030043525 申请日期 2003.06.30
申请人 DAEWOO ELECTRONICS CORPORATION 发明人 LEE, HYO YEOL
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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