发明名称 |
HEAT SINK FOR PRINTED CIRCUIT BOARD HAVING AIR CIRCULATION STRUCTURE CAPABLE OF INCREASING AIR CONTACT AREA OF THE HEAT SINK |
摘要 |
PURPOSE: A heat sink is provided to increase the air contact area of the heat sink and achieve improved cooling effects by permitting air to circulate through the heat sink. CONSTITUTION: A heat sink(30) is installed at a PCB so as to absorb and radiate heat generated from elements. The heat sink has an air circulation portion(34) having an opening(32). The heat sink has a plurality of air inlet holes(36) for communicating an intermediate part of the air circulation portion to outside so as to circulate air.
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申请公布号 |
KR20050002187(A) |
申请公布日期 |
2005.01.07 |
申请号 |
KR20030043525 |
申请日期 |
2003.06.30 |
申请人 |
DAEWOO ELECTRONICS CORPORATION |
发明人 |
LEE, HYO YEOL |
分类号 |
H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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