发明名称 FLEXIBLE PRINTED CIRCUIT BOARD FOR SHIELDING ELECTROMAGNETIC INTERFERENCE, INCLUDING CONDUCTIVE LAYERS FORMED ON OUTERMOST UPPER AND LOWER SURFACES OF BOARD
摘要 PURPOSE: A flexible printed circuit board is provided to shield electromagnetic interference, by forming conductive layers on an outermost upper surface and an outermost lower surface of the board and electrically connecting the conductive layers to a ground wire. CONSTITUTION: A flexible printed circuit board comprises a base film(105); a first conductive layer(110) formed beneath the base film; a conductive path including a data wire(120D) for transmitting a data signal and a ground wire(120G), wherein the conductive path is formed on the base film; a solder resin layer(130) for covering the base film and the conductive path exposed by the conductive path; and a second conductive layer(140) formed on the solder resin layer, and electrically connected to the second conductive layer via one or more holes formed on the ground wire.
申请公布号 KR20050001697(A) 申请公布日期 2005.01.07
申请号 KR20030041973 申请日期 2003.06.26
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KANG, SUNG RAE
分类号 H05K1/02;(IPC1-7):H05K1/02 主分类号 H05K1/02
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