| 摘要 |
PURPOSE: A wafer aligning method is provided to improve overlay accuracy by using a defectless alignment mark. CONSTITUTION: Several alignment marks are arbitrarily selected from a plurality of wafer alignment marks formed on a wafer(S1). A predetermined pattern inspection is performed on the selected alignment marks to detect defects(S2). When defects are detected from an alignment mark, another adjacent alignment mark is selected and the inspection is repeated(S3). Finally, defectless alignment marks are selected. An aligning process is performed on the wafer by using the defectless alignment marks(S4).
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