HIGH DENSITY CHIP SCALE PACKAGE AND FABRICATING METHOD THEREOF TO BROADEN EFFECTIVE AREA FOR FORMING SOLDER BALL AND INCREASE NUMBER OF PINS

摘要

PURPOSE: A high density chip scale package is provided to broaden an effective area for forming solder balls and increase the number of pins by making a cavity for mounting a die not included in a PCB(printed circuit board). CONSTITUTION: A circuit pattern is formed in a die(311). The die is mounted on a PCB including a circuit pattern wherein the area of the PCB 100-150 percent of the area of the die. A heat sink(315) is mounted on the die to radiate the heat of the die. Encapsulant(314) shields the die from the outside, injected to a gap between the die and the heat sink and closely attaching the PCB to the heat sink.