发明名称 POROUS POLISHING CLOTH WITH PROLONGED LIFETIME FOR CMP PROCESS
摘要 PURPOSE: A polishing cloth for a CMP(Chemical Mechanical Polishing) process is provided to prolong the lifetime by forming a plurality of pores capable of becoming grooves in the polishing cloth itself. CONSTITUTION: A polishing cloth includes a plurality of first grooves(11) containing slurry on the surface and a plurality of first to third pores(12a,12b,12c) under the surface. The polishing cloth is abraded as time goes by, so that the first to third pores changes to grooves. The first to third pores are alternately arranged with each other. The upper portion of each second pore is higher than the lower portion of each first pore.
申请公布号 KR20050002378(A) 申请公布日期 2005.01.07
申请号 KR20030043755 申请日期 2003.06.30
申请人 HYNIX SEMICONDUCTOR INC. 发明人 HAN, SUK BIN
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
代理机构 代理人
主权项
地址