Separation/isolation of a thermal interface material, at integrated circuits and the like, has a closed isolation unit pressed against the circuit board around the heater between the board and the heat dissipation unit

摘要

The structure to separate or insulate a thermal interface material has a ring-shaped and closed isolation unit (20) around a heater (10), forming an enclosed space to hold and separate the intermediate material. When the temperature of the heater rises, it flows over into the intermediate material. The isolation unit is pressed by a heat dissipation unit (30) tightly against its under side and against the upper surface of a printed circuit board (11).