发明名称 LOADING APPARATUS OF SEMICONDUCTOR WAFER FOR LESSENING PHYSICAL INTERFERENCE OF WAFER USING BUFFER UNIT
摘要 PURPOSE: A loading apparatus of a semiconductor wafer is provided to lessen physical interference between a wafer and a FOUP(Front Open Unit Pot) body or between the wafer and a slot by using a buffer unit. CONSTITUTION: A loading apparatus(100) of a semiconductor wafer includes a FOUP door, slots and a buffer unit. The FOUP door(110) allows a semiconductor wafer to be transferred by switching the door itself. The slots(120) are regularly arranged to load the wafer. The buffer unit(400) is installed opposite to the FOUP door. The buffer unit includes at least one pair of support parts(410) and a plurality of branch parts(420) prolonged from each support part.
申请公布号 KR20050001495(A) 申请公布日期 2005.01.07
申请号 KR20030041676 申请日期 2003.06.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 IM, CHANG KEUN;JANG, TAE HO
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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