发明名称 |
X-RAY FLUORESCENCE ANALYSIS METHOD FOR PLATING FILM |
摘要 |
PROBLEM TO BE SOLVED: To easily and accurately measure composition even if a thin plating film like an electrode of an electronic part. SOLUTION: This is an X-ray fluorescence analysis method for the plating film 5 in the electronic part wherein a thick film electrode 3 is formed on a ceramic element assembly 2 and the plating films 4, 5 with a thickness D of 2μm≤D≤25μm. It is characterized by measuring the trace quantity Pb content in the plating film 5 with the fluorescent X ray of M-line sequence. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005003471(A) |
申请公布日期 |
2005.01.06 |
申请号 |
JP20030166054 |
申请日期 |
2003.06.11 |
申请人 |
MURATA MFG CO LTD |
发明人 |
HIGUCHI SHOICHI;YODA HARUYUKI |
分类号 |
G01N23/223;(IPC1-7):G01N23/223 |
主分类号 |
G01N23/223 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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