发明名称 X-RAY FLUORESCENCE ANALYSIS METHOD FOR PLATING FILM
摘要 PROBLEM TO BE SOLVED: To easily and accurately measure composition even if a thin plating film like an electrode of an electronic part. SOLUTION: This is an X-ray fluorescence analysis method for the plating film 5 in the electronic part wherein a thick film electrode 3 is formed on a ceramic element assembly 2 and the plating films 4, 5 with a thickness D of 2μm≤D≤25μm. It is characterized by measuring the trace quantity Pb content in the plating film 5 with the fluorescent X ray of M-line sequence. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005003471(A) 申请公布日期 2005.01.06
申请号 JP20030166054 申请日期 2003.06.11
申请人 MURATA MFG CO LTD 发明人 HIGUCHI SHOICHI;YODA HARUYUKI
分类号 G01N23/223;(IPC1-7):G01N23/223 主分类号 G01N23/223
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