发明名称 FILM THICKNESS MEASURING METHOD AND FILM THICKNESS MEASURING DEVICE
摘要 PROBLEM TO BE SOLVED: To enable measurement of the thin film thickness which is difficult hitherto to be measured. SOLUTION: A measuring spectrum waveform can be expressed approximatively by the linear sum of a plurality of base spectrums by a characteristic of the waveform shape of an interference spectrum. Hereby, the base spectrum wherein the film thickness is determined beforehand as a variable is used, and an approximate spectrum wherein the square error to the measuring spectrum becomes the least is found relative to each film thickness, and the relation between the least square error and the film thickness is determined as a graph (S1-S6). When the film thickness is thin, a minimal point does not appear clearly on the error curve. In this case, a graph determined by turning over the error curve to the negative direction is taken into consideration, and the error at the film thickness zero point undetermined by calculation is determined by interpolation processing (S7, S8), and positive and negative peak separation processing of the error curve is performed (S9). Then, the film thickness showing the minimal point with a peak in the positive range is adopted as the thickness of the sample film (S10). COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005003401(A) 申请公布日期 2005.01.06
申请号 JP20030164492 申请日期 2003.06.10
申请人 SHIMADZU CORP 发明人 SHINYA KAZUYA;TSUJI SHIRO
分类号 G01B11/06;(IPC1-7):G01B11/06 主分类号 G01B11/06
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