发明名称 MACHINING DEVICE AND MACHINING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a machining device which is particularly fit for machining of a difficult-to-machine material, and to provide a machining method which can machine a workpiece with high accuracy and high quality by using the machining device. SOLUTION: The machining device has both an infrared heating furnace 7 which heats the workpiece W set in the machining device to a predetermined temperature below a fusing temperature, and a tool cooling means such as a vaporization heat cooling device 10 for cooling a ball end mill T which machines the workpiece W, and machines the workpiece W which is softened by heating, by the ball end mill T which is hardened by cooling. According to the machining method, machining is carried out by taking into consideration a thermal deformation quantity of the workpiece by heating, in addition to a shape data of the workpiece. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005001025(A) 申请公布日期 2005.01.06
申请号 JP20030164624 申请日期 2003.06.10
申请人 TSUNE SEIKI CO LTD 发明人 TANABE IKUO
分类号 B23C3/00;B23B1/00;(IPC1-7):B23B1/00 主分类号 B23C3/00
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