| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method, a polishing method and a scratch reducing method for a substrate which notably reduce nano-scratches and wide scratches with very wide width of 10-50 μm and shallow depth of 5 nm or less, and moreover allow efficient polishing. <P>SOLUTION: The substrate manufacturing method uses a polishing fluid composition containing abrasives, an oxidizer, acid and/or its salt, and water, and a polishing pad having a surface member with an average pore diameter of 0.01-35 μm. The substrate polishing method uses: the polishing fluid composition containing the abrasives, oxidizer, acid and/or its salt, and water; and the polishing pad having the surface member with the average pore diameter of 0.01-35 μm. The scratch reducing method uses the polishing fluid composition containing the abrasives, oxidizer, acid and/or its salt, and water, and the polishing pad having the surface member with the average pore diameter of 0.01-35 μm. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
