CARBON BLACK FOR SEMICONDUCTOR ENCAPSULATION MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a carbon black for a semiconductor encapsulation material capable of preventing current leakage failure even in a semiconductor device having extremely small distance of gold wires. SOLUTION: The carbon black for a semiconductor encapsulation material is produced by coating a carbon black having a volatile content of≥5 wt.% with a resin and has a THF-soluble content of≤60 wt.% based on the coating resin. The carbon black and non-insulating coarse particles included in the carbon back are firmly covered with the insulation resin. Even if the non-insulating coarse particle in the carbon black or the coagulated carbon black is brought into contact with the gold wire of a semiconductor device having extremely small gold wire distance in a state placed close to the wire or connecting the wires, electric current is not passed through the particle, etc. Accordingly, the leakage failure caused by the non-insulating coarse particle or the coagulated carbon black is suppressed by the use of the carbon black. COPYRIGHT: (C)2005,JPO&NCIPI