APPARATUS HAVING MOVABLE SOLVENT SPRAYING PART WITH NOZZLES FOR REMOVING PHOTORESIST BEADS FROM WAFER EDGE

摘要

PURPOSE: An apparatus is provided to remove completely a photoresist layer from an edge of a wafer by using a movable solvent spraying part with a plurality of nozzles. CONSTITUTION: An apparatus includes a rotatable wafer chuck, a movable solvent spraying part and a solvent supply line. The wafer chuck(101) loads a wafer(102). The solvent spraying part(312) capable of moving to and fro is spaced apart from an edge of the wafer as much as a predetermined distance. The solvent spraying part includes a plurality of nozzles(313). The solvent supply line(111) is used for providing a solvent to the nozzles.