LEAD FRAME DEVICE WITH VENTED DIE FLAG

摘要

A molded plastic semiconductor package (10) having reduced sensitivity to moisture level includes a die paddle (22) having at least one aperture (26) extending therethrough. A semiconductor die (30) is bonded to a first surface (32) of the die paddle (22) and spans the aperture (26). Once the semiconductor die (30) is electrically interconnected to an array of lead pads (24), the molding resin (42) encapsulates the semiconductor die (30) and first sides (32) of the die paddle (22) and array of lead pads (24). Opposing second sides of the die paddle (22) and array of lead pads (24) are exposed through a package surface in a QFN (Quad Flat No lead) configuration. The egress of moisture absorbed by the package (10) is facilitated by way of the aperture (26).