| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wire wound electronic component having improved thermal shock resistance. <P>SOLUTION: The wire wound electronic component comprises a core 1 composed of a ferrite material, a coil conductor 2 wound around a specified region of the core 1, and a sealing part 4 arranged around the coil conductor 2 to seal the coil conductor 2 and containing magnetic powder, low thermal expansion powder having a coefficient of linear expansion of 5.0×10<SP>-6</SP>or less and thermosetting resin. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
