发明名称 |
THIN FILM DEPOSITION SYSTEM AND THIN FILM DEPOSITING METHOD |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thin film deposition system and thin film depositing method capable of homogeneously depositing thin films on a substrate of a large area. <P>SOLUTION: The thin film deposition system 1 is so constituted that a mask 5 having apertures 5a and 5b opened with the regions on the substrate 3 corresponding to erosion regions 7a and 7b moves together with a magnet 4 for generating the erosion regions 7a between a target 2 and the substrate 3 when the magnet 4 moves to the plane direction of the target 2. The particles released from the target 2 arrive at the regions 3 corresponding to the erosion regions 7a and 7b through the apertures 5a and 5b but the arrival thereof at the regions on the substrate 3 exclusive thereof is obstructed by the mask 5. The magnet 4 and the mask 5 move together and only the particles past the apertures 5a and 5b are deposited on the substrate 3 and the homogeneous thin films can be formed over a wide area without the formation of the heterogeneous thin films. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
申请公布号 |
JP2005002433(A) |
申请公布日期 |
2005.01.06 |
申请号 |
JP20030168697 |
申请日期 |
2003.06.13 |
申请人 |
FUJI ELECTRIC HOLDINGS CO LTD |
发明人 |
WADA KATSUHITO |
分类号 |
C23C14/54;C23C14/35;H01L21/28;H01L21/285;H01L31/04;(IPC1-7):C23C14/54 |
主分类号 |
C23C14/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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