SOLDERING CONNECTION, ITS SOLDERING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT BY USING THE METHOD

摘要

PROBLEM TO BE SOLVED: To provide soldering connection using zinc group lead-free solder having high soldering junction intensity.

SOLUTION: A 1st alloy layer 30 constituted of the alloy layer 31 of a tin and copper which is formed on a soldering pad 2, and 2nd lead-free solder 32 including tin/silver as main components and formed on the alloy layer 31 and a 2nd allow layer 35 formed between the 1st alloy layer 30 and a 1st lead-free solder 34, are formed between the 1st lead-free solder layer 34 and the soldering pad 2.

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