| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a liquid circulation type cooling device which efficiently radiates heat when cooling a high exothermic semiconductor element. <P>SOLUTION: This cooling device for a semiconductor is installed in a rear face corner of a server frame body, and a side face of the server frame body is formed with a slit 6. Thereby, low-temperature fresh external air is taken in, and a pressure loss in a fan 4 is reduced, so that a high airflow rate is obtained. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
