| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin resin-made hollow package that is excellent in moisture resistance. <P>SOLUTION: This resin-made hollow package is constituted to expose the top surfaces of one end sections of leads in the hollow section of the package, the bottom surfaces of the other ends of the leads on the bottom surface of the package, and the bottom surface of an island composed of a steam-impermeable plate-shaped body having the same size as that of the bottom surface of at least a semiconductor element fitted to the internal bottom face of the hollow section on the bottom surface of the package. The island is disposed in the same plane as that of a lead frame or at a position higher than the surface of the lead frame. In addition, the island is connected to the lead frame through a hanging pin, and the hanging pin is embedded in the resin in a state where the pin is bent in a cross-folded state. Preferably, the island is disposed at a position higher than the surface of the lead frame by 5-100 μm. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
