CMOS TYPE IMAGE SENSOR MODULE APPLIED WITH TRANSPARENT POLYMER MATERIAL AND ITS MANUFACTURING PROCESS

摘要

PROBLEM TO BE SOLVED: To provide a camera being used as a peripheral of a personal computer and a CIS module being used in a general mobile camera.

SOLUTION: A first semiconductor chip for image sensor and a second semiconductor chip for processing digital signal are arranged on the upper and lower surfaces of a substrate and injection molded with sealing resin of a transparent polymer material or the first and second semiconductor chips are stuck tightly by transfer molding system and sealed hermetically by injection molding system thus producing a semiconductor package module for image sensor applied with the transparent polymer material. Its manufacturing process is also provided. Since a sealing resin part is formed by performing the molding process only once, cost reduction effect can be attained.

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