发明名称 MANUFACTURING METHOD OF SEALING PLATE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a sealing plate capable of suppressing effectively the occurrence of a permeating phenomenon of the electrolytic solution into the jointing face of the sealing plate main body and the electrode terminal 5. SOLUTION: This is the manufacturing method of the sealing plate in which an electrode terminal 5 is integrated into a sealing plate main body made of a polymer material by an insert molding and, at the mold setting of the molding dies 21 used for insert molding, the molding die 21 is pressure-contacted to an end face 5a of the electrode terminal 5 and the molding material 4a of the sealing plate main body is dammed up. An annular protrusion part 24 which cuts into the end face 5a of the electrode terminal 5 by mold setting is provided beforehand at the molding die 21, and the diameter dimension of this annular protrusion part 24 is established smaller than the outer peripheral part 5b at the end face 5a of the electrode terminal 5. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005004968(A) 申请公布日期 2005.01.06
申请号 JP20030163567 申请日期 2003.06.09
申请人 NOK CORP;OTALITO KK 发明人 NAKAYAMA JUNICHI;TOKIKAWA SHUNJI;ONO HIROSHI
分类号 H01G9/10;H01G9/00;H01M2/04;H01M2/06;H01M2/30;(IPC1-7):H01M2/04 主分类号 H01G9/10
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