| 摘要 |
PROBLEM TO BE SOLVED: To provide an exposure method which can respond to both positive and negative processes with a single mask, and to provide equipment therefor. SOLUTION: When irradiating light from a light source 1 onto a wafer W via an optical system 2 and 2a, either of the processes can be selected that a process wherein a pattern formed on the mask 6 is transferred as it is, and a process wherein an inverted image of the pattern formed on the mask 6 is transferred. COPYRIGHT: (C)2005,JPO&NCIPI
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